EF1000Lead-free and wash-free flux
Product features
Halogen-free, low solid content, low rosin medium activity wash-free flux.
Product advantage
● Less and uniform surface residue after welding;
● Excellent welding performance and low defect rate, even in the process of adding Sn/Cu alloy to OSP board.
● No cleaning to reduce production cost;
● Good heat resistance and excellent performance in double wave process;
● Full solder joints after welding;
● The residue has no corrosion and does not stick to hands.
Application range
Suitable for lead-free soldering, such as Sn/Cu and Sn/Ag/Cu alloy, single and double-sided board process.
Parameter
